Copper Sulfide (CuS) Sputtering Targets
Composition: Copper Sulfide (CuS)
Catalog No.DPSF29ST
Purity:99.9% ~ 99.999%Please click 
for discount and other size
- Product Details
Copper Sulfide (CuS) sputtering target specifications
Formula: CuS
CAS No.: 1317-40-4
Max. dia. of flat disc sputter target: 8"
Typical lead time of CuS sputtering target:5 weeks
Regular Dimensions and Price of Copper Sulfide (CuS) Sputtering Target
| Product Name | Reference Price | |
| 2"diax 1/8"t Copper Sulfide sputtering target | $965 | Add to Chart |
| 3"diax 1/8"t Copper Sulfide sputtering target | $1,130 | Add to Chart |
| 2"diax 1/8"t CuS sputtering target with In bonding to Cu bck plt | $1,045 | Add to Chart |
| 3"diax 1/8"t CuS sputtering target with In bonding to Cu bck plt | $1,265 | Add to Chart |
About Our Sputtering Target
QS Advanced Materials Inc is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Sulfides sputter targets
Sputtering Copper Sulfide
Sputtering technique are frequently used to create a thin film of Copper Sulfide . The CuS target material is placed on the electrode in the sputteringchamber. Heavy ion particle or laser are frequently used to ejecting coatingmaterial from the target, made by Copper Sulfide in this case, to create athin film of CuS on the surface of the substrate.
Copper Sulfide Sputtering Target Packaging
QS Advanced Materials Incs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA
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