Boron (B) Sputtering Targets
Composition: Boron
Catalog No.DPME5ST
Purity:99.5%Please click for discount and other size
- Product Details
Boron (Boron ) sputtering target specifications
Formula: Boron
CAS No.: 7440-42-8
Max. dia. of flat disc sputter target: 18"
Typical lead time of Boron sputtering target:3 weeks
Regular Dimensions and Price of Boron (Boron ) Sputtering Target
Product Name | Reference Price | |
2"diax 1/8"t Boron sputtering target | $676.5 | Add to Chart |
3"diax 1/8"t Boron sputtering target | $739 | Add to Chart |
2"diax 1/8"t Boron sputtering target with In bonding to Cu bck plt | $757 | Add to Chart |
3"diax 1/8"t Boron sputtering target with In bonding to Cu bck plt | $874 | Add to Chart |
About Our Sputtering Target
QS Advanced Materials Inc is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Single Element sputter targets
About Boron
Boron is a metalloid element with unique electronic and optical properties. It can be used as a dopant in semiconductor materials, such as silicon, to modify their electrical characteristics and improve device performance. Boron-doped silicon is commonly used in the fabrication of p-type semiconductor devices, such as transistors and solar cells. Additionally, boron compounds like boron carbide (B4C) and boron nitride (BN) have potential applications in electronic and optoelectronic devices due to their wide bandgaps, high thermal conductivity, and exceptional mechanical properties. The versatility of boron-based materials makes them valuable for a range of electronic, energy, and defense-related applications.;
Boron Sputtering Target Packaging
QS Advanced Materials Incs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA
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