Copper Aluminum Composite Bimetal Material
QS Advanced Materials is now cooperating with Enhanced Materials Technology Co. Ltd.(上海应撼材料科技有限公司) to deliver a new type of copper clad aluminum, or copper aluminum bimetal material. Our material is produced by a newly developed process that combine aluminum casting and rolling together. After years of innovation, this state of the art process obtained perfect combination of aluminum and copper. As the connection rate between layers of this copper clad aluminum is 100% and very strong, the material could be used as conductive material of electric power/signal and heat. According to analytic results, the conductivity of our copper clad aluminum foil is equal to the theoretical value of the parallel combine of the corresponding aluminum and copper. For applications in colling system, our bimetal plate unites the light weight and heat dissipation of aluminum and thermal conductivity of copper. More importantly, this casting rolling process has the capability to
manufacture thick bimetal plates (up to 20mm) continuously, which is almost impossible for traditional cladding
techniques.
Manufacturer's website(Chinese)
copper clad aluminum bimetallic application
Copper aluminum connector, cable slug
LiB copper aluminum terminal
Battery connector
Li ion Battery lead tab
Electric conductive busbar
Conductive foil on electric circuits plates(PCB, FPC, LED)
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Copper clad aluminum foil
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
copper aluminum bond strength: >40MPa
Thickness: 0.02mm-0.3mm
Width: 10~950mm
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Copper clad aluminum plate
Catalog No.:CCA-plate
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper clad aluminum strip
Catalog No.:CCA-strip
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum composite material
Catalog No.:CCA
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic foil
Catalog No.:CCA-foil
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic plate
Catalog No.:CCA-plate
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic strip
Catalog No.:CCA-strip
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic busbar
Catalog No.:CCA-busbar
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic connector
Catalog No.:
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic LiB terminal
Catalog No.:CCA-terminal
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm