Copper Tungsten(Cu-W) sputter target

Tungsten copper target introduction

Tungsten Copper (W-Cu) is a composite material composed of tungsten (W) and copper (Cu). It combines the high melting point and hardness of tungsten with the excellent thermal conductivity of copper. Tungsten copper exhibits high melting point and hardness along with good thermal conductivity. When used as a sputter target in the electronics industry, W-Cu is commonly employed for packaging and electrode materials. Due to its thermal expansion coefficient similar to materials such as silicon, silicone, and ceramics, tungsten copper is frequently utilized in electronic packaging. Additionally, its high wear resistance and electrical conductivity make it suitable for electrode components in electron tubes and high-frequency devices, providing stable current transfer and high-temperature resistance.

QSAMs copper tungsten products

As a composite material rather than a true alloy, W-Cu cannot be produced using conventional melting furnaces due to tungsten's extremely high melting point. At QSAM, our W-Cu sputter targets are typically fabricated via powder metallurgy methods. This involves mixing tungsten and copper powders followed by sintering at high temperature and pressure to achieve a dense, homogeneous target material. QS Advanced Materials can supply both tungsten copper and silver tungsten sputtering targets in a variety of shapes to meet research and production needs. As a premier provider of tungsten composite materials, QSAM is always ready to receive inquiries from customers. We welcome custom target design opportunities and encourage potential clients to reach out with their specifications and drawings. Our applications laboratory is well-equipped to assist with design, prototyping and testing of non-standard sputter targets.

Common composition of copper-Tungsten alloy

Composition wt. %	Density g/cm3	Hardness HB Kgf/mm2	Resistivity micro Ome*cm	IACS%	Bending strengthMpa
W50/Cu50	11.85	115	3.2	54	-
W55/Cu45	12.3	125	3.5	49	-
W60/Cu40	12.75	140	3.7	47	-
W65/Cu35	13.3	155	3.9	44	-
W70/Cu30	13.8	175	4.1	42	790
W75/Cu25	14.5	195	4.5	38	885
W80/Cu20	15.15	220	5	34	980
W85/Cu15	15.9	240	5.7	30	1080
W90/Cu10	16.75	260	6.5	27	1160

Tungsten copper packaging

Tungsten copper is stable in air and packed without vacuum seal, unless requested. Wooden crater is applied when the cargo is over weight.

*Mill report available for our tungsten  copper sputter target.

Related Product

Tungsten Heavy Metal Alloy (W-Ni-Fe) Bucking Bar

Tungsten (W) Pellets

Tungsten Heavy Metal Alloy (W-Ni-Cu)Custom Machined Parts