Silicon (Si) (undoped) Sputtering Targets
Composition: Silicon
Catalog No.DPMA14ST
Purity:99.9% ~ 99.999%Please click 
for discount and other size
- Product Details
Silicon (Si) sputtering target specifications
Formula: Si
CAS No.: 7440-21-3
Max. dia. of flat disc sputter target: 18"
Typical lead time of Si sputtering target:3 weeks
Regular Dimensions and Price of Silicon (Si) Sputtering Target
| Product Name | Reference Price | |
| 2"diax 1/8"t Silicon sputtering target | P.O.R. | Add to Chart |
| 3"diax 1/8"t Silicon sputtering target | P.O.R. | Add to Chart |
| 2"diax 1/8"t Si sputtering target with In bonding to Cu bck plt | P.O.R. | Add to Chart |
| 3"diax 1/8"t Si sputtering target with In bonding to Cu bck plt | P.O.R. | Add to Chart |
About Our Sputtering Target
QSAM is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Single Element sputter targets
About Silicon
Undoped Silicon, also referred to as intrinsic silicon, is pure silicon without any significant additions of other elements. It is a fundamental material in semiconductor technology, serving as the base material for creating various doped regions within electronic devices. Intrinsic silicon has balanced electron and hole concentrations and is used in applications such as photovoltaic cells, sensors, and integrated circuits. Thin films of undoped silicon can be deposited using CVD, MBE, and sputtering techniques, forming the foundational layers for semiconductor devices.;
Silicon Sputtering Target Packaging
QSAMs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA
Related Product