Titanium (Ti) Sputtering Targets
Composition: Titanium
Catalog No.DPME22ST
Purity:99.0% ~ 99.99%Please click 
for discount and other size
- Product Details
Titanium (Ti) sputtering target specifications
Formula: Ti
CAS No.: 7440-32-6
Max. dia. of flat disc sputter target: 18"
Typical lead time of Ti sputtering target:2 weeks
Regular Dimensions and Price of Titanium (Ti) Sputtering Target
| Product Name | Reference Price | |
| 2"diax 1/8"t Titanium sputtering target | $260.5 | Add to Chart |
| 3"diax 1/8"t Titanium sputtering target | P.O.R. | Add to Chart |
| 2"diax 1/8"t Ti sputtering target with In bonding to Cu bck plt | $341 | Add to Chart |
| 3"diax 1/8"t Ti sputtering target with In bonding to Cu bck plt | P.O.R. | Add to Chart |
About Our Sputtering Target
QSAM is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Single Element sputter targets
Sputtering Titanium
Thanks to an ideal mix of high strength, low weight, corrosion resistance, and biocompatibility, thin films of the metal titanium deposited by sputtering find ubiquitous use across diverse industries. For example, titanium coatings allow lighter, more durable aerospace components and provide decorative corrosion protection for buildings.
Specifically, sputtering involves energized argon ions striking and ejecting titanium atoms from a target inside a vacuum chamber. The ejected Ti atoms then condense and deposit as a uniform film on a substrate. By tuning key parameters like argon pressure, applied power, target-substrate spacing, and substrate temperature, engineers can control the film
Related Product