Tungsten
Tungsten (W) is known for its strength and high melting point. It plays an important role in many high-tech applications. Beyond widely used tungsten metal and alloys, its compounds like tungsten trioxide (WO3), tungsten disulfide (WS2), and tungsten diselenide (WSe2) are also useful in electronics and semiconductors.
WO3 is used in electrochromic devices that change their optical properties when electricity is applied. These are used in smart windows to control heat and light transmission for better energy efficiency in buildings. WS2 and WSe2 belong to the family of transition metal dichalcogenides (TMDCs). These materials are gaining interest in next-generation electronics and photonics due to their unique electrical and optical properties. As 2D materials, WS2 and WSe2 may be used to make semiconductors for transistors, photodetectors, and flexible electronics because of their exceptional charge carrier mobility and stability.
Tungsten and its compounds are also highly valued for sputtering coatings. Sputtering involves bombarding a source material, called a sputtering target, with ions to eject atoms that deposit as a thin film on a substrate. This technique is essential for applying precise, uniform layers in semiconductor manufacturing and for coating surfaces in various industrial applications.
Tungsten targets, including W, WO3, WS2, and WSe2, are key for depositing thin films to produce integrated circuits, wear-resistant coatings, and various electronic and electromagnetic devices. Using tungsten-based sputtering targets allows creation of coatings that can significantly improve component performance by enhancing conductivity, wear-resistance, and thermal properties.
The versatility of tungsten and its compounds is clear from their widespread use across electronics, electromagnetic, and semiconductor industries. By offering various tungsten products for refractory applications and sputtering coatings, suppliers like QS Advanced Materials enable advancement of technology in these fields, facilitating development of cutting-edge devices and systems.
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High Density Tungsten Alloy (W-Ni-Fe) Plate
Composition: W/Ni/Fe
Catalog No.: RF74I-Plate
Material purity: 99.95%
Typical lead time: 3 weeks
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High Density Tungsten Alloy (W-Ni-Fe) Custom Machined Parts
Composition: W/Ni/Fe
Catalog No.: RF74I-CM
Material purity: 99.95%
Typical lead time: 3 weeks
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High Density Tungsten Alloy (W-Ni-Cu)Rod
Composition: W/Ni/Cu
Catalog No.: RF74C-Rod
Material purity: 99.95%
Typical lead time: 3 weeks
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High Density Tungsten Alloy (W-Ni-Cu)Bar
Composition: W/Ni/Cu
Catalog No.: RF74C-Bar
Material purity: 99.95%
Typical lead time: 3 weeks
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High Density Tungsten Alloy (W-Ni-Cu)Plate
Composition: W/Ni/Cu
Catalog No.: RF74C-Plate
Material purity: 99.95%
Typical lead time: 3 weeks
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Tungsten Heavy Metal Alloy (W-Ni-Cu)Custom Machined Parts
Composition: W/Ni/Cu
Catalog No.: RF74C-CM
Material purity: 99.95%
Typical lead time: 3 weeks
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Copper Tungsten(Cu-W)Rod
Composition: Copper, Tungsten(Cu,W)
Catalog No.: RF7429-Rod
Material purity: 99.95%
Typical lead time: 3 weeks
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Copper Tungsten(Cu-W)Plate
Composition: Copper, Tungsten(Cu,W)
Catalog No.: RF7429-Plate
Material purity: 99.95%
Typical lead time: 3 weeks
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Copper Tungsten(Cu-W)Ingot
Composition: Copper, Tungsten(Cu,W)
Catalog No.: RF7429-Ingot
Material purity: 99.95%
Typical lead time: 3 weeks
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Copper Tungsten(Cu-W)Electrode
Composition: Copper, Tungsten(Cu,W)
Catalog No.: RF7429-ED
Material purity: 99.95%
Typical lead time: 3 weeks
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Silver Tungsten(Ag-W)Alloy
Composition: Silver, Tungsten(Ag,W)
Catalog No.: RF7447
Material purity: 99.95%
Typical lead time: 3 weeks