Tungsten Titanium (W/Ti) Sputtering Targets
Composition: Tungsten and Titanium
Catalog No.DPMA74ST
Purity:99.9% ~ 99.95%Please click 
for discount and other size
- Product Details
Tungsten Titanium (W/Ti) sputtering target specifications
Formula: W/Ti
CAS No.: 58397-70-9
Max. dia. of flat disc sputter target: 18"
Typical lead time of W/Ti sputtering target:3 weeks
Regular Dimensions and Price of Tungsten Titanium (W/Ti) Sputtering Target
| Product Name | Reference Price | |
| 2"diax 1/8"t Tungsten Titanium sputtering target | $873.5 | Add to Chart |
| 3"diax 1/8"t Tungsten Titanium sputtering target | P.O.R. | Add to Chart |
| 2"diax 1/8"t W/Ti sputtering target with In bonding to Cu bck plt | $954 | Add to Chart |
| 3"diax 1/8"t W/Ti sputtering target with In bonding to Cu bck plt | P.O.R. | Add to Chart |
About Our Sputtering Target
QSAM is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Alloys sputter targets
About Tungsten Titanium
Tungsten titanium (WTi) is an alloy composed of tungsten and titanium, known for its high electrical conductivity, thermal stability, and excellent adhesion to various substrates. It has a cubic crystal structure and can be deposited as thin films using sputtering techniques. Sputtered WTi films have found widespread applications in the semiconductor industry as diffusion barriers and interconnect materials. The high melting point and low resistivity of WTi make it suitable for preventing the interdiffusion of metals and enhancing the reliability of integrated circuits. Additionally, WTi films have been explored for their use as electrodes in various electronic devices, such as capacitors and resistive random-access memory (RRAM). The ability to deposit WTi by sputtering has greatly facilitated the fabrication of advanced electronic devices and has contributed to the miniaturization and performance enhancement of semiconductor technology.;
Tungsten Titanium Sputtering Target Packaging
QSAMs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA
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